Show simple item record

dc.contributor.authorAgrawal, Avantika Arya
dc.date.accessioned2022-07-01T11:54:50Z
dc.date.available2022-07-01T11:54:50Z
dc.date.issued2022
dc.identifier.urihttp://hdl.handle.net/10062/83039
dc.language.isoenget
dc.rightsopenAccesset
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectPCBAet
dc.subjectPCBet
dc.subjectBakinget
dc.subjectMoistureet
dc.subjectMSDet
dc.subjectDelaminationet
dc.subjectCracket
dc.subjectSMDet
dc.titleHigh-Temperature PCBA Baking Process Optimizationet
dc.typeThesiset


Files in this item

Thumbnail
Thumbnail

This item appears in the following Collection(s)

Show simple item record

openAccess
Except where otherwise noted, this item's license is described as openAccess